CIRCUIT BOARD AND COMPUTING DEVICE

WIPO Patent Application WO/2020/093315

A1

A circuit board (10) and a computing device. The height of intermediate heat sinks (13A, 13B) of the circuit board (10) located in an intermediate region (20) of a PCB (11) is not higher than that of two side heat sinks (14A) in two side regions outside of the intermediate region (20); the height of a first heat sink group closest to a heat dissipation fan (3) among the intermediate heat sinks (13A, 13B) is lower than that of the two side heat sinks (14A) in the two side regions outside of the intermediate region (20); and the height of the first heat sink group closest to the heat dissipation fan (3) is not higher than that of other heat sinks in the intermediate region (20); and the intermediate region (20) is a region located on the PCB (11) corresponding to a central region of an axle of the heat dissipation fan (3). The arrangement above may increase the amount of air flowing through a heat dissipation air duct in the intermediate region (20) of the circuit board (10), improve the regional heat dissipation efficiency of the circuit board (10) corresponding to the central region of the axle of the external heat dissipation fan (3), and reduce the risk of the heat dissipation of heat source devices of the region.

XIU HONGYU (CN)

PCT/CN2018/114592

May 14, 2020

November 08, 2018

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BITMAIN TECH INC (CN)

H05K7/20

CN201230433Y	2009-04-29
CN204440306U	2015-07-01
CN108323114A	2018-07-24
CN207151064U	2018-03-27
CN101365320A	2009-02-11
US20080066888A1	2008-03-20

LEADER PATENT & TRADEMARK FIRM (CN)

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