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Patent Searching and Data


Title:
CIRCUIT BOARD DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/050909
Kind Code:
A1
Abstract:
A circuit board device having a filter element has a base board (4), a circuit section (2) mounted on the base board (4), a filter element (5) disposed between the circuit section (2) and the base board (4), and a semiconductor component (3) mounted on the base board (4) flush with the circuit section (2). The semiconductor component (3) is mounted on a sheet region (17) thinner than a blank region (16) more thickened by mounting the circuit section (2) on the base board (4). Thus, the whole of the circuit module is thinned and coated with a sufficiently thick dielectric insulator in the periphery of the filter element (5) to prevent filter characteristics from deteriorating.

Inventors:
HIRABAYASHI TAKAYUKI (JP)
OKUBORA AKIHIKO (JP)
Application Number:
PCT/JP2002/012723
Publication Date:
June 19, 2003
Filing Date:
December 04, 2002
Export Citation:
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Assignee:
SONY CORP (JP)
HIRABAYASHI TAKAYUKI (JP)
OKUBORA AKIHIKO (JP)
International Classes:
H01L21/48; H01L21/68; H01L23/498; H01L23/552; H01L23/66; H01L25/00; H01P1/00; H01P1/203; H01P1/205; H01P11/00; H05K1/16; H05K1/18; H05K3/46; (IPC1-7): H01P1/203; H01L25/00; H01P3/08
Foreign References:
JPH06291520A1994-10-18
Attorney, Agent or Firm:
Koike, Akira (Yamato Seimei Bldg. 1-7 Uchisaiwai-cho 1-chome Chiyoda-ku, Tokyo, JP)
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