Title:
CIRCUIT BOARD, ELECTRONIC DEVICE, CIRCUIT BOARD MANUFACTURING METHOD, AND MOTHERBOARD FOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/034716
Kind Code:
A1
Abstract:
This circuit board has mounted thereon an electronic component and is provided with: a base board having a first surface on which the electronic component is mounted, a second surface opposite to the first surface, and a side surface provided between the first surface and the second surface; a first conduction layer provided on the first surface; a second conduction layer provided on the second surface; a side-surface conduction layer which is provided on the side surface and through which the first conduction layer and the second conduction layer are interconnected; and an insulation layer provided so as to cover at least a connection section at which the second conduction layer and the side-surface conduction layer are interconnected.
Inventors:
YAMADA MITSUHIRO (JP)
KURIHARA TAKAHIRO (JP)
MITA YUSHI (JP)
KURIHARA TAKAHIRO (JP)
MITA YUSHI (JP)
Application Number:
PCT/JP2021/016645
Publication Date:
February 17, 2022
Filing Date:
April 26, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
NIPPON CARBIDE KOGYO KK (JP)
NIPPON CARBIDE KOGYO KK (JP)
International Classes:
H01L23/08; H01L23/04; H01L23/12; H01L23/14; H03H3/02; H03H9/02; H05K1/11; H05K3/28; H05K3/34
Domestic Patent References:
| WO2017208747A1 | 2017-12-07 | |||
| WO2017126596A1 | 2017-07-27 |
Foreign References:
| JP2000082762A | 2000-03-21 | |||
| JP2017046341A | 2017-03-02 | |||
| JP2000312062A | 2000-11-07 | |||
| JPS60167396A | 1985-08-30 | |||
| JP2009206297A | 2009-09-10 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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