Title:
CIRCUIT BOARD FOR HIGH FREQUENCY TRANSMISSION AND SHIELDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/004011
Kind Code:
A1
Abstract:
The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission comprises: a first shielding film, a second shielding film and a circuit board body. The circuit board body comprises a first surface and a second surface that are arranged to be opposite. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at the lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.
Inventors:
SU ZHI (CN)
Application Number:
PCT/CN2019/125925
Publication Date:
January 14, 2021
Filing Date:
December 17, 2019
Export Citation:
Assignee:
GUANGZHOU FANGBANG ELECTRONICS CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| CN105636336A | 2016-06-01 | |||
| CN108770214A | 2018-11-06 | |||
| CN109215859A | 2019-01-15 | |||
| US20070181996A1 | 2007-08-09 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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