CIRCUIT BOARD INTEGRATED INDUCTOR, INDUCTOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/124582

A1

The present application provides a circuit board integrated inductor, an inductor, and an electronic device. The circuit board integrated inductor comprises: a circuit board, a coil being embedded in the circuit board; a magnetic adhesive layer, which is provided on at least one side of the two opposite sides of the circuit board, and at least partially overlaps with the coil; and a magnetic film layer, which is provided on the side of the magnetic adhesive layer away from the circuit board, wherein the magnetic conductivity of the magnetic film layer is greater than that of the magnetic adhesive layer. According to the circuit board integrated inductor in the present application, the inductor is integrated in the circuit board, so that more ultrathin and miniaturized properties are achieved, and packaging efficiency is improved; in addition, the magnetic adhesive layer and the magnetic film layer are combined together to serve as a magnetic layer in the circuit board integrated inductor, so that an inductance value of the obtained circuit board integrated inductor far exceeds the accumulated value of the inductance of the independent magnetic adhesive layer and the inductance of the independent magnetic film layer, and the ultrathin property and high-sensitivity can be better achieved.

LAN HAO (CN)
CHEN YIJUN (CN)
XU FENG (CN)

PCT/CN2022/131515

July 06, 2023

November 11, 2022

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GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)

H05K1/16; H01F27/245; H01F27/28; H01F41/00; H05K3/00

CN114302558A	2022-04-08
CN114300232A	2022-04-08
CN108140468A	2018-06-08
US20160225512A1	2016-08-04

SCIHEAD IP LAW FIRM (CN)

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