Title:
CIRCUIT BOARD, MAINBOARD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/017163
Kind Code:
A1
Abstract:
The embodiments of the present application belong to the technical field of terminal devices, and particularly relate to a circuit board, a mainboard and an electronic device. The embodiments of the present application aim to solve the problem of inveracious soldering being easily formed between a shielding frame and a pad. In the circuit board, mainboard and electronic device provided in the present embodiment, a board body is provided with a first soldering area and a second soldering area, which are arranged at intervals along the edge of a device area, a first sub-pad and a second sub-pad are arranged in the first soldering area at intervals, the space between the first sub-pad and a shielding frame and the space between the second sub-pad and the shielding frame are relatively small, and when a solder is melted, the solder between the first sub-pad and the second sub-pad flows to the first sub-pad and the second sub-pad, thereby increasing the thickness of a soldering body between the first sub-pad and the shielding frame and the thickness of a soldering body between the second sub-pad and the shielding frame, and the formation of inveracious soldering is thus avoided, and an electromagnetic shielding effect of the shielding frame is improved.
Inventors:
LI MENGYUAN (CN)
QIN XIKUN (CN)
QIN XIKUN (CN)
Application Number:
PCT/CN2023/107472
Publication Date:
January 25, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K9/00
Foreign References:
| CN115348720A | 2022-11-15 | |||
| JP2013235961A | 2013-11-21 | |||
| JP2015192076A | 2015-11-02 | |||
| CN216253738U | 2022-04-08 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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