Title:
CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/000478
Kind Code:
A1
Abstract:
The present application relates to a circuit board manufacturing method and a circuit board. The method comprises: providing a substrate, forming a metal layer on the substrate, covering the side of the metal layer away from the substrate with a dry film, utilizing a mask to expose and develop the dry film, etching parts of the metal layer not covered by the dry film to form a metal circuit, where the mask comprises a light-blocking structure and a hollow area, the edge area of the light-blocking structure in proximity to the hollow area is a partially light-blocking structure, and the middle area of the light-blocking structure away from the hollow area is a fully light-blocking structure.
Inventors:
ZHANG LIGUAN (CN)
XU JIANYONG (CN)
XU JIANYONG (CN)
Application Number:
PCT/CN2020/100177
Publication Date:
January 06, 2022
Filing Date:
July 03, 2020
Export Citation:
Assignee:
OFILM GROUP CO LTD (CN)
NANCHAGN OFILM DISPLAY TECH CO LTD (CN)
NANCHAGN OFILM DISPLAY TECH CO LTD (CN)
International Classes:
G03F1/00; H05K3/06; H05K1/02
Foreign References:
| CN104062794A | 2014-09-24 | |||
| CN105655289A | 2016-06-08 | |||
| CN110621116A | 2019-12-27 | |||
| US20030207180A1 | 2003-11-06 | |||
| CN107145035A | 2017-09-08 | |||
| JP2007271891A | 2007-10-18 | |||
| CN107908074A | 2018-04-13 | |||
| CN106292171A | 2017-01-04 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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