Title:
CIRCUIT BOARD AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/172767
Kind Code:
A1
Abstract:
Provided are a circuit board and a manufacturing method enabling further improvement of thermal dissipation of an electronic component such as a semiconductor chip to be mounted by soldering on an additional metal layer joined to a circuit pattern by employing ultrasonic joining technique. In a circuit board 1, a circuit pattern 3 is provided on a substrate 5, and an additional metal layer 9 is overlaid on and joined to the circuit pattern 3. The additional metal layer 9 comprises: an attachment face portion 13 to which a semiconductor chip 11 is fixed by soldering; and an engagement recess-protrusion portion 17 provided adjacent to the attachment face portion 13 and with which a recess-protrusion portion of a tool engages, the tool being for transmitting vibration in order to join the additional metal layer 9 onto the circuit pattern 3 by ultrasonic vibration. The attachment face portion 13 is composed of a face with a smaller recess-protrusion than that of the engagement recess-protrusion portion 17.
Inventors:
TANAKA RYO (JP)
YAMAUCHI YUICHIRO (JP)
SUZUKI KOHEI (JP)
YAMAUCHI YUICHIRO (JP)
SUZUKI KOHEI (JP)
Application Number:
PCT/JP2022/003154
Publication Date:
August 18, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
B23K1/00; B23K20/10; H01L23/12; H01L23/13; H01L23/36
Domestic Patent References:
| WO2018143410A1 | 2018-08-09 |
Foreign References:
| JP2006245171A | 2006-09-14 | |||
| JP2018142570A | 2018-09-13 | |||
| JPH05235117A | 1993-09-10 | |||
| JP2002050730A | 2002-02-15 | |||
| JP2007123937A | 2007-05-17 | |||
| JP2010123680A | 2010-06-03 |
Attorney, Agent or Firm:
SUDO Yuichi et al. (JP)
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