CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIPO Patent Application WO/2003/088724

A1

At first, a sprocket hole (12) and a device hole (14) are made in a flexible tape-like transparent or translucent insulating base (11). A conductor is then laminated on the surface of the insulating base to form a conductive layer. Subsequently, a desired part of the conductive layer is etched to form a wiring pattern (13) and an alignment mark (15). Thereafter, a solder resist layer (16) is formed on portions except the terminal part of the wiring pattern and the alignment mark. Finally, a layer (17) having a transparent or translucent surface is formed on the insulating base around the alignment mark so that the light transmits the front and rear surfaces of the circuit board and the position of the alignment mark can be confirmed.

JP2007093793	PHOTOSENSITIVE FILM, PERMANENT PATTERN FORMING METHOD AND PATTERN
JPWO2008075401	Board structure, circuit board manufacturing method, circuit board inspection method and electronic equipment
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KOBAYASHI KATSUYOSHI

PCT/JP2003/003964

October 23, 2003

March 28, 2003

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SHINDO COMPANY LTD (JP)

H05K3/28; H01L21/60; H01L23/544; H05K1/02; H05K3/00; H05K1/00; (IPC1-7): H05K1/02; H01L21/60; H05K3/00; H05K3/28

JPH0249488A	1990-02-19
JPH05175623A	1993-07-13
JPH10163588A	1998-06-19
EP1041418A2	2000-10-04

Nakao, Shunsuke (Ginza 8-chome Chuo-ku, Tokyo, JP)

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