Title:
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/031502
Kind Code:
A1
Abstract:
A circuit board, provided with: (1) an electronic component including a first substrate, an electrode provided on at least one surface of the first substrate, a meltable conductor provided on the electrode, an outer casing having an internal space for housing the meltable conductor and having one or more vents, and a first sealing member for sealing the vents; (2) a second substrate on which the electronic compound is provided; and (3) a second sealing member for sealing the electronic component provided on the second substrate.
Inventors:
FURUUCHI YUJI (JP)
FURUTA KAZUTAKA (JP)
MUKAI KOUICHI (JP)
FURUTA KAZUTAKA (JP)
MUKAI KOUICHI (JP)
Application Number:
PCT/JP2015/072094
Publication Date:
March 03, 2016
Filing Date:
August 04, 2015
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01H37/76
Domestic Patent References:
| WO2014123139A1 | 2014-08-14 |
Foreign References:
| JP2014209467A | 2014-11-06 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Patent business corporation wings international patent firm (JP)
Patent business corporation wings international patent firm (JP)
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