Title:
CIRCUIT BOARD AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2019/227435
Kind Code:
A1
Abstract:
A circuit board and a mobile terminal. Said circuit board comprises a support member and a first member stacked with the support member. The support member has a first step structure facing the first member, the first step structure having a first step surface and a second step surface, the first step surface being connected to the first member by means of first solder balls, the second step surface being connected to the first member by means of second solder balls, and the height of the first solder balls being greater than the height of the second solder balls. In the present application, a gap between the support member and the first member is locally increased by providing step surfaces on the support member; when the support member is connected to the first member, solder balls are respectively provided on the two step surfaces and are connected to the first member, such that the height of a part of solder balls can be increased; and the falling and temperature cycling stress of solder spots between the support member and the first member are reduced by means of increasing the height of the solder balls, improving the mechanical and environmental reliability of the whole circuit board, thereby improving the safety of the circuit board during use.
Inventors:
SHI HONGBIN (CN)
LONG HAOHUI (CN)
LONG HAOHUI (CN)
Application Number:
PCT/CN2018/089368
Publication Date:
December 05, 2019
Filing Date:
May 31, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/48
Foreign References:
| US5214308A | 1993-05-25 | |||
| TW200713613A | 2007-04-01 | |||
| US8232658B2 | 2012-07-31 | |||
| US20040124540A1 | 2004-07-01 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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