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Patent Searching and Data


Title:
CIRCUIT BOARD MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221682
Kind Code:
A1
Abstract:
The present application relates to the technical field of communication. Disclosed are a circuit board module (210) and a communication device (1), with the aim of improving the heat dissipation performance of the circuit board module (210). The circuit board module (210) comprise a substrate (60), an optical module assembly (20), an elastic member (70) and a heat sink (80). The optical module assembly (20) comprises a housing (21) and an optical module (22), wherein the housing (21) is arranged on a side of the substrate (60), an opening is provided in the side of the housing (21) facing away from the substrate (60), and the optical module (22) is inserted into the housing (21) from a first end of the housing (21) in a first direction; a first end of the elastic member (70) is fixedly connected to the substrate (60), and a second end of the elastic member (70) is fixedly connected to the side of the housing (21) facing the substrate (60); and the heat sink (80) is arranged on the side of the housing (21) facing away from the substrate (60), the heat sink (80) is fixedly connected to the substrate (60), the side of the heat sink (80) facing the substrate (60) is provided with a boss (81), which is opposite the opening in terms of position, and the boss (81) can extend into the housing (21) through the opening and can come into contact with the optical module (22) inserted into the housing (21).

Inventors:
LI XIAODONG (CN)
LIN PEIQING (CN)
LIN FENG (CN)
Application Number:
PCT/CN2023/087177
Publication Date:
November 23, 2023
Filing Date:
April 08, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; G02B6/42
Domestic Patent References:
WO2014141490A12014-09-18
WO2022083149A12022-04-28
Foreign References:
CN107191816A2017-09-22
CN101998801A2011-03-30
CN213151096U2021-05-07
CN104684245A2015-06-03
JP2018136437A2018-08-30
US20090213552A12009-08-27
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