Title:
CIRCUIT BOARD AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/126453
Kind Code:
A1
Abstract:
Disclosed are a circuit board and a preparation method therefor, the circuit board comprising: a substrate layer; a transmission line layer comprising a plurality of conductor bosses, wherein a gap is formed between two adjacent conductor bosses to expose at least part of the substrate layer; and an insulation heat-conducting layer comprising a plurality of heat-conducting portions, wherein the gap between the two adjacent conductor bosses is filled with a corresponding heat-conducting portion, and the height of the heat-conducting portion is larger than that of the conductor boss to form a connection groove. The circuit board provided in the present application can improve heat dissipation performance of the circuit board.
Inventors:
TANG CHANGSHENG (CN)
Application Number:
PCT/CN2020/136965
Publication Date:
June 23, 2022
Filing Date:
December 16, 2020
Export Citation:
Assignee:
SHENNAN CIRCUITS CO LTD (CN)
International Classes:
H05K7/20; H05K1/02
Foreign References:
| CN211267243U | 2020-08-14 | |||
| CN110996503A | 2020-04-10 | |||
| CN211240270U | 2020-08-11 | |||
| CN101212862A | 2008-07-02 | |||
| TW201325363A | 2013-06-16 | |||
| US20150257261A1 | 2015-09-10 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
Download PDF:
Previous Patent: ELECTRET MEMBRANE, PREPARATION METHOD, REFRIGERATOR BODY ASSEMBLY AND REFRIGERATION APPARATUS
Next Patent: STORAGE APPARATUS
Next Patent: STORAGE APPARATUS