Title:
CIRCUIT BOARD RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN POWDER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2024/090112
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a circuit board resin composition that can reduce environmental load and that can be used as a material for manufacturing circuit boards in which the dielectric constant is reduced. The present invention pertains to a circuit board resin composition containing resin powder particles having a halogen content of 3 mass% or less.
Inventors:
FURUKO AKIRA (JP)
Application Number:
PCT/JP2023/035250
Publication Date:
May 02, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08L101/00; C08F8/04; C08J3/12; C08L45/00; C08L65/00
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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