Title:
CIRCUIT BOARD AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2018/021473
Kind Code:
A1
Abstract:
A circuit board, provided with: a ceramic substrate having a first surface and a second surface; a first metal part having a first metal plate joined to the first surface and convex parts projecting from the surface of the first metal plate; and a second metal part having a second metal plate joined to the second surface. When the ceramic substrate is equally divided along the long side direction into first through third divided parts, V1, V2, V3, V4, V5, and V6 are numbers satisfying (V4/V1) + (V6/V3) ≤ 2(V5/V2), 0.5 ≤ V4/V1 ≤ 2, 0.5 ≤ V5/V2 ≤ 2, and 0.5 ≤ V6/V3 ≤ 2.
Inventors:
KATO HIROMASA (JP)
SANO TAKASHI (JP)
SANO TAKASHI (JP)
Application Number:
PCT/JP2017/027241
Publication Date:
February 01, 2018
Filing Date:
July 27, 2017
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA MATERIALS CO LTD (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
H01L23/13; H01L23/36
Domestic Patent References:
| WO2011034075A1 | 2011-03-24 |
Foreign References:
| JP2011091184A | 2011-05-06 | |||
| JPH07221265A | 1995-08-18 | |||
| JPH104156A | 1998-01-06 | |||
| JP2007299974A | 2007-11-15 | |||
| JP2004134703A | 2004-04-30 |
Other References:
See also references of EP 3493253A4
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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