Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/043183
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern layer including a first metal layer disposed on the insulating layer; a protective layer disposed on the insulating layer and including a groove portion that vertically overlaps the first metal layer and has a step in the horizontal direction; and a second metal layer disposed in the groove portion of the protective layer, wherein the groove portion includes a portion having a larger width than the first metal layer, and the second metal layer is disposed in the portion of the groove portion with a width larger than that of the first metal layer.
Inventors:
NA SE WOONG (KR)
KIM SANG IL (KR)
LEE KEE HAN (KR)
KIM SANG IL (KR)
LEE KEE HAN (KR)
Application Number:
PCT/KR2022/013714
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/34; H01L23/28; H01L23/52; H05K1/11; H05K3/40
Foreign References:
| JP2017118067A | 2017-06-29 | |||
| KR20140018016A | 2014-02-12 | |||
| KR20210051536A | 2021-05-10 | |||
| JP2015179730A | 2015-10-08 | |||
| JP2004327743A | 2004-11-18 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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