Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/039228
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a circuit pattern layer disposed between the first insulating layer and the second insulating layer, wherein the second insulating layer has a cavity penetrating the upper and lower surfaces of the second insulating layer, and the circuit pattern layer comprises an electrode pad disposed on the bottom surface of the cavity, and a dummy electrode disposed on the bottom surface of the cavity, spaced apart from the electrode pad, and surrounding the outside of the electrode pad.
Inventors:
LEE DONG KEON (KR)
SHIN JUN SIK (KR)
YUN NAM GYU (KR)
CHOI SO HEE (KR)
SHIN JUN SIK (KR)
YUN NAM GYU (KR)
CHOI SO HEE (KR)
Application Number:
PCT/KR2023/012290
Publication Date:
February 22, 2024
Filing Date:
August 18, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/03; H01L23/00; H01L23/13; H01L23/498; H01L23/538; H05K1/11; H05K1/18; H05K3/28
Foreign References:
| KR20210046978A | 2021-04-29 | |||
| KR20220069401A | 2022-05-27 | |||
| JP2008118075A | 2008-05-22 | |||
| KR20100088336A | 2010-08-09 | |||
| US20190131224A1 | 2019-05-02 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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