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Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/072186
Kind Code:
A1
Abstract:
A semiconductor package according to an embodiment comprises: an insulation layer; a plurality of electrode parts including a through-part extending therethrough from the upper surface of the insulation layer to a partial area thereof; and a connection member embedded in the insulation layer, wherein the plurality of electrode parts include a first electrode part including a first through-part vertically overlapping the connection member and a second electrode part including a second through-part which does not vertically overlap the connection member, and the size of the first through-part satisfies a range of 80 % to 100 % of the size of the second through-part.

Inventors:
LEE SOO MIN (KR)
SIM WOO SEOP (KR)
YOO JONG HEUN (KR)
Application Number:
PCT/KR2023/015221
Publication Date:
April 04, 2024
Filing Date:
October 04, 2023
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/498; H01L25/065; H01L25/18; H05K1/11; H05K1/18
Foreign References:
KR20220001643A2022-01-06
KR20200041876A2020-04-22
US20190393145A12019-12-26
KR102380834B12022-03-31
KR20200028602A2020-03-17
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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