Title:
CIRCUIT BOARD, STRUCTURE FOR CONNECTING CONDUCTIVE MEMBERS, AND ELECTRICALLY-OPERATED COMPRESSOR
Document Type and Number:
WIPO Patent Application WO/2019/064998
Kind Code:
A1
Abstract:
This circuit board comprises: a peripheral portion on which an electrical circuit is formed on the surface thereof; an isolating portion on which a terminal is fixed; an insulating portion made from resin, which connects the isolating portion to the peripheral portion; and a reinforcing layer which is provided to the rear surface of the peripheral portion, the rear surface of the isolating portion, and the rear surface of the insulating portion. The reinforcing layer has a portion which covers a first boundary at which the insulating portion comes into contact with the peripheral portion, and a portion which covers a second boundary at which the insulating portion comes into contact with the isolating portion.
Inventors:
SASAKI YUJI (JP)
ISHIKAWA YU (JP)
MATSUZAWA YOSHINOBU (JP)
SHISHIDO MASAAKI (JP)
ISHIKAWA YU (JP)
MATSUZAWA YOSHINOBU (JP)
SHISHIDO MASAAKI (JP)
Application Number:
PCT/JP2018/030833
Publication Date:
April 04, 2019
Filing Date:
August 21, 2018
Export Citation:
Assignee:
IHI CORP (JP)
International Classes:
H05K1/05; F04B39/00; H05K1/02; H05K1/14; H05K3/44; F16B5/10
Domestic Patent References:
| WO2012053580A1 | 2012-04-26 | |||
| WO2013018330A1 | 2013-02-07 | |||
| WO2017158662A1 | 2017-09-21 |
Foreign References:
| JPH02177492A | 1990-07-10 | |||
| JP2011100816A | 2011-05-19 | |||
| JP2016012721A | 2016-01-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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