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Title:
CIRCUIT BOARD STRUCTURE, ELECTRONIC PRODUCT, AND PREPARATION METHOD FOR CIRCUIT BOARD STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/184189
Kind Code:
A1
Abstract:
Disclosed are a circuit board structure (10), an electronic product, and a preparation method for the circuit board structure. The circuit board structure (10) comprises rigid connecting members (11) and at least two substrates, wherein each substrate is provided with an electronic element (14); the rigid connecting members (11) have electrical conductivity and are electrically and mechanically connected to the two adjacent substrates; and at least some of the rigid connecting members (11) are sandwiched between the two adjacent substrates, such that the at least two substrates are stacked with a space therebetween.

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Inventors:
SHEN ZHONGGUO (CN)
JU TAO (CN)
HU ZHENGGAO (CN)
CHENG GONG (CN)
Application Number:
PCT/CN2020/079642
Publication Date:
September 23, 2021
Filing Date:
March 17, 2020
Export Citation:
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Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H05K1/03
Foreign References:
CN209435538U2019-09-24
CN107529303A2017-12-29
CN206563864U2017-10-17
CN106982540A2017-07-25
CN210093807U2020-02-18
US20120002379A12012-01-05
Attorney, Agent or Firm:
SHENZHEN LIDAO INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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