Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/096458
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: a first insulating layer; a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer which is disposed on the first insulating layer and the first circuit pattern layer and is provided with a first cavity, wherein the first circuit pattern layer comprises a connection pattern portion comprising a first portion disposed inside the first cavity and a second portion extending from the first portion to the outside of the first cavity.
Inventors:
LEE DONG KEON (KR)
YOUH SEOK JONG (KR)
YOUH SEOK JONG (KR)
Application Number:
PCT/KR2022/019069
Publication Date:
June 01, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/18; H01L23/12; H01L23/498; H05K1/03; H05K1/11; H05K3/46
Foreign References:
| KR20210000105A | 2021-01-04 | |||
| KR101922884B1 | 2018-11-28 | |||
| KR20160150244A | 2016-12-29 | |||
| KR20200015974A | 2020-02-14 | |||
| KR20170067472A | 2017-06-16 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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