Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/113386
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: a first insulating layer; and a second insulating layer disposed on the top surface of the first insulating layer, wherein the second insulating layer includes a cavity, and the cavity has a planar shape including a plurality of convex portions which are convex toward the inside of the second insulating layer.
Inventors:
LEE SOO MIN (KR)
SHIN JONG BAE (KR)
JEONG JAE HUN (KR)
JUNG JI CHUL (KR)
SHIN JONG BAE (KR)
JEONG JAE HUN (KR)
JUNG JI CHUL (KR)
Application Number:
PCT/KR2022/020028
Publication Date:
June 22, 2023
Filing Date:
December 09, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/02; H01L23/12; H01L23/538; H05K1/11; H05K1/18; H05K3/46
Foreign References:
| KR20210000105A | 2021-01-04 | |||
| KR102329360B1 | 2021-11-22 | |||
| KR101922884B1 | 2018-11-28 | |||
| KR20160150244A | 2016-12-29 | |||
| KR20170067472A | 2017-06-16 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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