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Title:
CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/228888
Kind Code:
A1
Abstract:
A circuit component according to the present inventio is provided with: an insulating layer that is configured from a ceramic; and a conductor layer that extends within the insulating layer in the plane direction and/or in a direction that intersects with the plane direction. The conductor layer comprises a metal phase and silica particles; and the silica particles are enclosed in the metal phase.

Inventors:
SANO HIROAKI (JP)
HIGASHI TOSHIFUMI (JP)
IMOTO AKIRA (JP)
YAMAGUCHI TAKAFUMI (JP)
YAMAMOTO SENTAROU (JP)
Application Number:
PCT/JP2023/018838
Publication Date:
November 30, 2023
Filing Date:
May 19, 2023
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/09; H05K3/46
Foreign References:
JP2001044633A2001-02-16
JP2004134378A2004-04-30
JPH06305770A1994-11-01
JP2007081320A2007-03-29
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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