Title:
CIRCUIT DEVICE, METHOD FOR MANUFACTURING CIRCUIT DEVICE, AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2019/012977
Kind Code:
A1
Abstract:
An ECU 1 is provided with a circuit board 10, a connector 20 secured to the circuit board 10, and a resin part 50 covering the circuit board 10 and the connector 20. The connector 20 is provided with a housing body 22, and a cutoff receiving part 27 protruding from the housing body 22. The cutoff receiving part 27 is provided with a flange part 28 protruding outward from the housing body 22, and a flexible wall 29 extending from the flange part 28 and slanting so as to approach the housing body 22 toward the leading end thereof, and part of the flexible wall 29 is embedded in the resin part 50.
Inventors:
KOMORI HIROKAZU (JP)
KAWASHIMA NAOMICHI (JP)
HIRAI HIROKI (JP)
HIGASHIKOZONO MAKOTO (JP)
MORIYASU MASANORI (JP)
KAWASHIMA NAOMICHI (JP)
HIRAI HIROKI (JP)
HIGASHIKOZONO MAKOTO (JP)
MORIYASU MASANORI (JP)
Application Number:
PCT/JP2018/024097
Publication Date:
January 17, 2019
Filing Date:
June 26, 2018
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/56; H01L23/28; H01R12/72; H05K3/28; H05K5/00
Foreign References:
| JPH10223667A | 1998-08-21 | |||
| JPH1076528A | 1998-03-24 | |||
| JP2001237557A | 2001-08-31 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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