Title:
CIRCUIT LAMINATE FILM FOR WAFER-LEVEL PACKAGING AND SEALING, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/151517
Kind Code:
A1
Abstract:
Disclosed are a circuit laminate film for wafer-level packaging and sealing, a preparation method therefor, and an application thereof. The laminate film comprises 40-60 parts by mass of a first-type epoxy resin, 15-30 parts by mass of a second-type epoxy resin, 25-50 parts by mass of a curing agent, 0.1-5 parts by mass of a curing accelerator, 5-20 parts by mass of an auxiliary agent, 320-650 parts by mass of an inorganic filler, and 0.01-5 parts by mass of a silane coupling agent. The auxiliary agent is obtained by reacting an epoxy resin with a dendritic crosslinking agent comprising multiply hydroxyl groups at the tail end. The laminate film of the present invention has good fluidity when heated and cured, and can completely fill gaps between wafers. A packaging process that uses the laminate film is simple regardless of the number of wafers, and packaging can be completed by using the laminate film by means of one procedure.
Inventors:
WU DE (CN)
LIAO SHUHANG (CN)
WANG YI (CN)
SU JUNXING (CN)
LIANG FEIFEI (CN)
LIAO SHUHANG (CN)
WANG YI (CN)
SU JUNXING (CN)
LIANG FEIFEI (CN)
Application Number:
PCT/CN2021/073213
Publication Date:
July 21, 2022
Filing Date:
January 22, 2021
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
H01L21/56; C08J5/18; C08K3/36; C08K5/5435; C08L63/00; C08L63/02; H01L23/29
Foreign References:
| CN110997765A | 2020-04-10 | |||
| CN109233211A | 2019-01-18 | |||
| CN102112516A | 2011-06-29 | |||
| CN107778774A | 2018-03-09 | |||
| CN101475685A | 2009-07-08 | |||
| CN104403087A | 2015-03-11 | |||
| JP2007314740A | 2007-12-06 | |||
| CN1282105A | 2001-01-31 | |||
| CN109486100A | 2019-03-19 |
Attorney, Agent or Firm:
WUHAN SINOPOWER PATENT AGENCY (CN)
Download PDF: