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Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2017/022789
Kind Code:
A1
Abstract:
A circuit module (50) mounted on a parent substrate (40) is provided with a heat-generating component (54), a circuit board (52a) on which the heat-generating component (54) is mounted, a recess (55) formed on the surface of the circuit module (50) facing the parent substrate (40), and a heat dissipation member (56) disposed on the inner wall of the recess (55) and on at least a part of the edge of the recess (55) on said surface.

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Inventors:
SATO KAZUSHIGE (JP)
Application Number:
PCT/JP2016/072779
Publication Date:
February 09, 2017
Filing Date:
August 03, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/36; H01L23/12; H01L23/28; H01L23/29; H01L25/04; H01L25/18; H03B5/32
Foreign References:
JP2006216674A2006-08-17
JP2011182017A2011-09-15
JP2003086755A2003-03-20
JP2012114334A2012-06-14
JP2000058741A2000-02-25
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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