Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2022/124022
Kind Code:
A1
Abstract:
Provided is a circuit module capable of shielding electromagnetic waves passing not only laterally of an electronic component but also under the electronic component. A circuit module 10 according to the present invention is provided with a main substrate 20, an electronic component 30A mounted on the main substrate 20, and a sub-module 40 mounted on the main substrate 20. The sub-module 40 includes a sub-substrate 41 and an electronic component 30D. The sub-substrate 41 includes a bottom plate 41A mounted on the main substrate 20 and a side plate 41B extending upward from the bottom plate 41A. The electronic component 30D is mounted on an upper surface 41Aa of the bottom plate 41A. A shield pattern 46 is formed on a lower surface 41Ab of the bottom plate 41A and on an outer surface 41Bb of the side plate 42.
Inventors:
SATO RYOTA (JP)
KUSUNOKI MOTOHIKO (JP)
NOMURA TADASHI (JP)
KUSUNOKI MOTOHIKO (JP)
NOMURA TADASHI (JP)
Application Number:
PCT/JP2021/042078
Publication Date:
June 16, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K9/00; H05K1/02; H05K1/14; H05K3/28
Domestic Patent References:
| WO2014178153A1 | 2014-11-06 | |||
| WO2020049989A1 | 2020-03-12 | |||
| WO2006121478A2 | 2006-11-16 |
Foreign References:
| JP2007294828A | 2007-11-08 | |||
| JP2002223095A | 2002-08-09 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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