CIRCUIT-PATTERN INSPECTION DEVICE

WIPO Patent Application WO/2011/102511

A1

Provided is a circuit-pattern inspection device which enables the efficient inspection of a semiconductor wafer by selectively inspecting areas on the semiconductor wafer where defects are likely to occur during the step of producing the semiconductor wafer, such as boundaries between patterns thereon, while changing the beam-scanning direction for each area. Two-dimensional beam-deflection control is employed for inspection operations in a continuous-stage-movement-type circuit-pattern inspection device in which only one-dimensional scanning has been employed conventionally. That is, by employing a combination of electron-beam-deflection control in a first direction parallel to the stage-movement direction and electron-beam-deflection control in a second direction intersecting the stage-movement direction, it is possible to obtain an image of any given area for inspection that is set within a swath. The amplitude of the deflection signals for the electron-beam deflection and the rise and fall timings of the signals are controlled as appropriate depending on inspection conditions.

YAMAMOTO TAKUMA (JP)
HIROI TAKASHI (JP)
OMINAMI YUSUKE (JP)

PCT/JP2011/053686

August 25, 2011

February 21, 2011

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HITACHI HIGH TECH CORP (JP)
YAMAMOTO TAKUMA (JP)
HIROI TAKASHI (JP)
OMINAMI YUSUKE (JP)

H01L21/66; G01N23/225; H01J37/20; H01J37/22

JP2003031629A	2003-01-31
JPH09180667A	1997-07-11
JP2009027190A	2009-02-05
JP2008053170A	2008-03-06
JP2005116795A	2005-04-28
JP2000057985A	2000-02-25

POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)

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