Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/216465
Kind Code:
A1
Abstract:
This circuit structure is provided with: a circuit substrate; inductors arranged on the circuit substrate and each provided with a core member and a coil that has a winding part formed by winding a winding wire; and a heat dissipation plate arranged on the circuit substrate on the side opposite the surface on which the inductors are arranged, wherein through-holes are provided in the circuit substrate in regions corresponding to the inductors, and receiving protrusions that pass through the through-holes, protrude toward the surface of the circuit substrate on which the inductors are arranged, and are in heat transfer contact with the coils or the coil members are provided in regions corresponding to the through-holes in the dissipation plate.
Inventors:
TSUCHIDA TOSHIYUKI (JP)
YAMANE SHIGEKI (JP)
YAMANE SHIGEKI (JP)
Application Number:
PCT/JP2018/017879
Publication Date:
November 29, 2018
Filing Date:
May 09, 2018
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01F27/08; H01F17/04; H01F27/06; H01F27/22; H01F27/28; H05K7/20
Foreign References:
| JPS5219655U | 1977-02-12 | |||
| JPH10199731A | 1998-07-31 | |||
| JP2013149943A | 2013-08-01 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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