Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/238758
Kind Code:
A1
Abstract:
Disclosed is a circuit structure with which it is possible to reduce stress generated in an interface between a thermal conductive member and a case. A circuit structure 10 comprises: heat-generating components 12, 14; a bus bar 18 connected to connection portions 16 of the heat-generating components 12, 14; a case 20 housing the heat-generating components 12, 14 and the bus bar 18; and a thermal conductive member 24 which is placed on a placement surface 22 of the case 20 and is sandwiched between, and in thermal contact with, the case 20 and the bus bar 18. The case 20 includes a displacement regulating portion 118 that engages with the thermal conductive member 24 to regulate displacement of the thermal conductive member 24.
Inventors:
IGURA KOUSHI (JP)
SHIMODA HIROKI (JP)
YANAGIDA TAIJI (JP)
SHIMODA HIROKI (JP)
YANAGIDA TAIJI (JP)
Application Number:
PCT/JP2023/020404
Publication Date:
December 14, 2023
Filing Date:
June 01, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; H02G3/16; H05K5/02
Domestic Patent References:
| WO2021230125A1 | 2021-11-18 |
Foreign References:
| JP2006217736A | 2006-08-17 | |||
| JP2019169602A | 2019-10-03 | |||
| JPS58103170U | 1983-07-13 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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