Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/004727
Kind Code:
A1
Abstract:
Disclosed is a circuit structure capable of reducing a mounting area occupied by a heat transfer member in a housing and improving heat radiation efficiency of a heat generating component using an energization busbar. A circuit structure 10 comprises: a heat generating component 22; and an energization busbar 26. The energization busbar 26 has a hollow duct 32 which extends and penetrates through the energization busbar 26 and which has a first opening 28 opened at one end of the energization busbar 26 and a second opening 30 opened at the other end. The energization busbar 26 has a first connection pipe body 60 which is coupled, in a fluid-tight manner, to the one end of the energization busbar 26 and which surrounds and is in communication with the first opening 28, and a second connection pipe body 62 which is coupled, in a fluid-tight manner, to the other end of the energization busbar 26 and which surrounds and is communication with the second opening 30. The first connection pipe body 60 has a first duct coupling port 68 connectable to a refrigerant source 34. The second connection pipe body 62 has a second duct coupling port 70 connectable to the refrigerant source 34.
Inventors:
SUGIURA JO (JP)
KUBOKI HIDEYUKI (JP)
ISAJI YUSUKE (JP)
KUBOKI HIDEYUKI (JP)
ISAJI YUSUKE (JP)
Application Number:
PCT/JP2023/022536
Publication Date:
January 04, 2024
Filing Date:
June 19, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L23/473; H02G3/16; H02M7/48; H05K7/20
Domestic Patent References:
| WO2018021084A1 | 2018-02-01 |
Foreign References:
| JP2021164184A | 2021-10-11 | |||
| JPS63198399A | 1988-08-17 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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