Title:
CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2020/196528
Kind Code:
A1
Abstract:
A circuit substrate according to the present disclosure includes: a substrate made of ceramic; a bonding layer positioned on the substrate; and a metal layer positioned on the bonding layer. In addition, the metal layer contains copper. In addition, the bonding layer contains aluminum, silicon, and oxygen.
Inventors:
ABE YUICHI (JP)
MUNEISHI TAKESHI (JP)
MUNEISHI TAKESHI (JP)
Application Number:
PCT/JP2020/013039
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C22C21/00; B23K35/28; C04B37/02; H01L23/13; H01L23/36; H01L23/373; H05K1/02
Foreign References:
| JP2017135197A | 2017-08-03 | |||
| JPH11154719A | 1999-06-08 | |||
| JP2010016349A | 2010-01-21 |
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