Title:
CIRCUIT SUBSTRATE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/162578
Kind Code:
A1
Abstract:
A circuit substrate (1) is provided with an electronic component (100), and a printed wiring board (20) on which the electronic component (100) is mounted by soldering. The electronic component (100) comprises a pad electrode (120) disposed on a bottom portion of a body portion (110). The pad electrode (120) includes a tip-end electrode portion (120a) protruding laterally from a first side surface of the body portion (110), and an inner electrode portion (120b) which is provided integrally with the tip-end electrode portion (120a) and is positioned on a bottom surface of the body portion (110). The printed wiring board (20) includes a first pad (211) and a second pad (212) which is spaced apart from the first pad (211) on the substrate (21). The tip-end electrode portion (120a) is bonded with the first pad (211) by soldering, and the inner electrode portion (120b) is bonded with the second pad (212) by soldering.
Inventors:
MOTOFUSA TOSHIHARU
YAMANAKA SHOHEI
YAMANAKA SHOHEI
Application Number:
PCT/JP2023/002671
Publication Date:
August 31, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K3/34; H05K1/18
Domestic Patent References:
| WO2006014690A2 | 2006-02-09 |
Foreign References:
| JPH06310840A | 1994-11-04 | |||
| JP2005294632A | 2005-10-20 | |||
| JPH08104070A | 1996-04-23 | |||
| JP2022025389A | 2022-02-10 |
Attorney, Agent or Firm:
OHASHI, Makoto et al. (JP)
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