CIRCUMFERENTIAL POLISHING DEVICE FOR DISC-SHAPED WORKPIECES

WIPO Patent Application WO/2013/168444

A1

[Problem] To provide a circumferential polishing device capable of polishing edges of a workpiece having different bevel angles. [Solution] An edge polishing unit (2A, 2B) that polishes edges (Ea, Eb) on the front and back faces of a workpiece (W) comprises: a polishing part mount (11) to which a polishing part (10) is mounted; a mount support part (12) that tiltably supports the polishing part mount (11); an angle adjusting mechanism for the mount (13) that adjusts the tilt angle of the polishing part mount (11); an oscillation support base (15) that pivotably supports the mount support part (12) along an oscillation line; a base support (17) that tiltably supports the oscillation support base (15); an angle adjusting mechanism for a base (18) that adjusts the tilt angle of the oscillation support base (15) so that the same is parallel to the workpiece (W) edge (Eb); and a base (19) that supports the base support (17) in the horizontal and vertical directions so that the position can be corrected.

JP3006458	[Title of Invention] Inner peripheral blade grindstone
JP2004058242	METHOD FOR CORRECTING CAST DEBURRING POSITION DEVIATION
JP3178941	SPINNERET

KATO TADAHIRO (JP)
ENARI AKITOSHI (JP)
IRAGO MITSUTAKA (JP)

PCT/JP2013/053485

November 14, 2013

February 14, 2013

Click for automatic bibliography generation  

SHINETSU HANDOTAI KK (JP)
SPEEDFAM CO LTD (JP)

B24B9/00; H01L21/304

JP2002144201A	2002-05-21
JP2002137155A	2002-05-14
JP2003145399A	2003-05-20
JP2005026274A	2005-01-27
JPH11221744A	1999-08-17
JP2009018364A	2009-01-29

HAYASHI Naoki et al. (JP)
Tadao Hayashi tree (JP)

View/Download PDF      PDF Help

Previous Patent: WIRELESS SYSTEM CONTROL DEVICE AND CONTROL METHOD

Next Patent: SEMICONDUCTOR LASER MODULE