TECHNICAL FIELD

[0001] The instant specification generally relates to electronic device fabrication. More specifically, the instant specification relates to clamping mechanisms for securing substrates on carriers.

BACKGROUND

[0002] An electronic device manufacturing apparatus can include multiple chambers, such as process chambers and load lock chambers. Such an electronic device manufacturing apparatus can employ a robot apparatus in the transfer chamber that is configured to transport substrates between the multiple chambers. In some instances, multiple substrates are transferred together. However, those substrates may move, dislodge, or otherwise become misaligned during transfer by the robot apparatus.

SUMMARY

[0003] In accordance with an embodiment, a substrate carrier is provided. The substrate carrier includes a carrier base, a substrate receiving area in the carrier base, and a clamping mechanism disposed on the carrier base adjacent to a first side of the substrate receiving area. The clamping mechanism comprises a material compressible by a substrate inserted into the substrate receiving area to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier.

[0004] In accordance with another embodiment, a method is provided. The method includes forming, within a carrier base of a substrate carrier, a plurality of substrate receiving areas each having a substrate-shaped depression comprising a plurality of sidewalls, and forming a clamping mechanism disposed adjacent to a first sidewall of the plurality of sidewalls of at least one of the plurality of substrate receiving areas. The clamping mechanism comprises a material compressible by a substrate inserted into the substrate receiving area to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier.

[0005] In accordance with yet another embodiment, a method is provided. The method includes providing a substrate carrier having a clamping mechanism disposed adjacent to a first side of a substrate receiving area, and securing a substrate to the substrate receiving area using the clamping mechanism to form a carrier assembly. The clamping mechanism comprises a material compressible by a substrate inserted into the substrate receiving area to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects and implementations of the present disclosure will be understood more fully from the detailed description given below and from the accompanying drawings, which are intended to illustrate aspects and implementations by way of example and not limitation.

[0007] FIG. 1A is a perspective view of a substrate carrier, in accordance with some embodiments.

[0008] FIG. IB is a perspective view of a clamping mechanism of the substrate carrier of FIG. 1A, in accordance with some embodiments.

[0009] FIG. 1C is a top-down view of the clamping mechanism of FIG. IB, in accordance with some embodiments.

[0010] FIG. 2 is a top-down view the formation of a carrier assembly, in accordance with some embodiments.

[0011] FIG. 3A is a perspective view of a carrier assembly disposed on a susceptor, in accordance with some embodiments.

[0012] FIG. 3B is a cross-sectional view of an apparatus including a mask disposed on the carrier assembly of FIG. 3A, in accordance with some embodiments.

[0013] FIG. 3C is a cross-sectional view of a blown-up region of the apparatus of FIG. 3B, in accordance with some embodiments.

[0014] FIG. 4A is a top-down view of a carrier assembly prior to insertion of a substrate, in accordance with some embodiments.

[0015] FIGs. 4B and 4C are top-down views of the carrier assembly of FIG. 4A after insertion of the substrate, in accordance with some embodiments.

[0016] FIG. 4D is a cross-sectional view of the carrier assembly of FIG. 4C, in accordance with some embodiments.

[0017] FIG. 5 is a flow chart of a method for forming a substrate carrier, in accordance with some embodiments. [0018] FIG. 6 is a flow chart of a method for forming a carrier assembly, in accordance with some embodiments.

[0019] FIG. 7 is a flow chart of a method for utilizing a carrier assembly, in accordance with some embodiments.

DETAILED DESCRIPTION

[0020] During electronic device fabrication, a substrate carrier (e.g., a ceramic substrate carrier) can be used to carry a substrate. However, vibration during substrate carrier transportation, which can be high-speed, can cause the substrate to dislodge from the carrier. This is particularly true for a lightweight substrate, such as a substrate made of a lightweight glass material (e.g., glass coupons). Once the substrate is dislodged from the carrier, manual intervention from a technician may be performed in order to properly place the substrate back into the substrate carrier. Such manual intervention can delay processing of the substrate and/or other substrates that might also be carried on the substrate carrier. Failure to place the substrate back into a proper position on the substrate carrier prior to processing can result in breakage of the substrate and/or faulty etch or deposition of films on the dislodged substrate and/or other substrates on the substrate carrier.

[0021] Approaches to this problem have generally relied on applying an external force to keep the substrate secure to the substrate carrier. One type of external force is a vacuum force. However, use of a vacuum force is limited to certain conditions, and thus cannot be applied universally within all environments. Additionally, adding a vacuum capability to a substrate carrier increases a complexity of the substrate carrier substantially and also increases a cost of the substrate carrier. Another type of external force that may be used for a substrate carrier is an attractive electrostatic force generated between the substrate carrier and the substrate by a device such as, e.g., an electrostatic chuck. However, such devices can also be expensive and/or complicated to use.

[0022] Aspects and implementations of the present disclosure address these and other shortcomings of existing technologies by providing clamping mechanisms for securing substrates to substrate carriers. The substrate can illustratively be comprised of a glass material (e.g., a glass coupon). However, such embodiments should not be considered limiting. The substrate may have a square or rectangular shape, as shown, or may have other shapes such as a disc shape or other polygonal shape. The substrate may be composed of, for example, a semiconductor body (e.g., a semiconductor wafer, a glass or ceramic body (e.g., a glass or ceramic coupon), a metal body, or some other type of material. [0023] More specifically, the substrate carrier can include a carrier base, at least one substrate receiving area in the carrier base, and a clamping mechanism disposed on the carrier base adjacent to a first side of the substrate received area. The carrier base can illustratively be comprised of a ceramic material (e.g., AIN, AI2O3, Y2O3, SiN, etc.) or a metal (e.g., such as aluminum, an aluminum alloy, stainless steel, etc.). The clamping mechanism includes a material compressible by a substrate inserted into the substrate receiving area to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier. Accordingly, the clamping mechanism can include a compressive body that compresses away from the second side responsive to insertion of the substrate into the substrate receiving area.

[0024] In some embodiments, the clamping mechanism includes an annular-shaped object wrapped around a circular structure built into the carrier base. More specifically, the annularshaped object can be disposed within a ring-shaped depression that circumscribes the circular structure. The clamping mechanisms in these embodiments can be comprised of a compressive material having material properties (e.g., bulk modulus, Young’s modulus, compressive strength, Poisson’s ratio, hardness) suitable for securing the substrate on the carrier. More specifically, the compressive material should have material properties that will not generate too strong of a compression force that can damage the substrate, while not generating too weak of a compression force that can enable the substrate to be dislodged from the carrier as a result of movement and/or vibration during device processing. Since environmental conditions (e.g., high temperature and/or high pressure) can affect material properties, the compressive material can be selected to maintain its properties and integrity in various environments. For example, the annular-shaped object can illustratively be formed from an elastic polymer (elastomer) or other material with elastic or rubber-like properties. More specifically, the annular-shaped object can include a saturated elastomer due to greater stability against potentially extreme environmental conditions. In some embodiments, friction between the annual shaped object and the substrate can result in an approximately vertical force that can further secure the substrate to the substrate carrier.

[0025] For example, the clamping mechanism can include an O-ring. As another example, the clamping mechanism can include an elastic washer, also referred to herein as a washer. An O-ring or elastic washer is generally used as a gasket placed in a groove to form a seal that prevents a gas and/or liquid from escaping at an interface, or as an object that can reduce noise levels caused by mechanical vibration.

[0026] In some embodiments, the clamping mechanism includes a polygonal -shaped object. For example, the polygonal-shaped object can be a quadrilateral-shaped object formed (e.g., a trapezoidal-shaped object). More specifically, the quadrilateral-shaped object can be a rounded quadrilateral-shaped object (e.g., a rounded trapezoidal-shaped object). In some embodiments, the polygonal -shaped object can include a nonstick material. The nonstick material can be, e.g., polytetrafluoroethylene (PTFE) or other suitable nonstick material.

[0027] Aspects of the present disclosure result in technological advantages over other approaches. For example, the clamping mechanisms described herein can work reliably in a variety of environments, as compared to vacuum force methods. As another example, the clamping mechanisms described herein can be easily installed on carriers at a reduced cost, as compared to electrostatic force methods that use devices such as, e.g., electrostatic chucks.

[0028] FIG. 1A is a perspective view of a substrate carrier 100, in accordance with some embodiments. The substrate carrier 100 is a substrate carrier including a carrier base 110 and a plurality of substrate receiving areas, including a substrate receiving area 112. In some embodiments, the carrier base 110 and the substrate receiving area 112 can include a ceramic material. However, such embodiments should not be considered limiting, and the carrier base 110 and the substrate receiving area 112 can include any material suitable for use within the substrate carrier 100, such as aluminum (Al), in accordance with the embodiments described herein. In some embodiments, one or more surface of the carrier base 110 is coated by a film. The film may be, for example, a ceramic such as AI2O3, Y2O3, AIN, and so on. The film may be deposited by a line-of site or non-line-of-site deposition technique, examples of which include plasma spraying, chemical vapor deposition (CVD), plasma vapor deposition (PVD), atomic layer deposition (ALD), and so on. The film may be grown, for example, by electroplating or anodization. For example, if the carrier is aluminum, then an AI2O3 film may be formed on all surfaces of the carrier base 110 by anodization. The carrier base 110 further includes a clamping mechanism 116 disposed adjacent to a side or edge 114 of the substrate receiving area 112. FIG. IB is a perspective view of a clamping mechanism 116 and FIG. 1C is a top-down view of the clamping mechanism 116, in accordance with some embodiments.

[0029] The clamping mechanism 116 includes a material compressible by a substrate inserted into the substrate receiving area 112 to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area 112 that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier 100. In some embodiments, the carrier base 110 can have an approximately flat upper surface, such that a top of the clamping mechanism 116 can be below or flush with the approximately flat upper surface of the carrier base 110. Accordingly, the clamping mechanism 116 can include a compressive body that can compress away from the second side responsive to insertion of the substrate into the substrate receiving area 112.

[0030] In this illustrative embodiment, the clamping mechanism 116 includes an annularshaped object wrapped around a circular structure 118 built into the carrier base 110. In some embodiments, and as shown in this illustrative example, the substrate receiving area 112 can be a substrate-shaped depression in the carrier base 110, and the annular-shaped object can be disposed within a ring-shaped depression that is adjacent to the substrate-shaped depression. The annular-shaped object can be disposed within the ring-shaped depression within the carrier base 110 that circumscribes the circular structure 118. The annular-shaped object is to compress against the circular structure 118 responsive to insertion of the substrate into the substrate receiving area 112.

[0031] In an example, the annular-shaped object of the clamping mechanism 116 can include an O-ring. As another example, the annul ar- shaped object of the clamping mechanism 116 can include a washer. The annular-shaped objects in these embodiments can be comprised of a compressive material having material properties (e.g., bulk modulus, Young’s modulus, compressive strength, Poisson’s ratio, hardness) suitable for securing the substrate on the carrier. More specifically, the compressive material should have material properties that will not generate too strong of a compression force that can damage the substrate, while not generating too weak of a compression force that can enable the substrate to be dislodged from the carrier as a result of movement and/or vibration during processing. Since environmental conditions (e.g., high temperature and/or high pressure) can affect material properties, the elastic material can be selected to maintain its properties and integrity in various environments. For example, the annular-shaped object can be illustrative comprised of an elastic polymer (elastomer) or other material with elastic or rubber-like properties. More specifically, the annular-shaped object can include a saturated elastomer due to greater stability against extreme environmental conditions. Examples of saturated elastomers include, but are not limited to, silicones (SI, Q, VMQ), fluorosilicones (FVMQ), fluoroelastomers (e.g., FKM and tetrafluoroethylene propylene (TFE/P)), and perfluoroelastomers (FFKM). In one embodiment, the compressive material comprises a perfluoropolymer (PFP) and/or a polyimide, which may retain its material properties at high temperature, and which may have resistance to erosion or corrosion caused by exposure to a plasma environment. Some examples of materials that may be used for the compressive material include Dupont’s™ ECCtreme™, Dupont’s KALREZ® (e.g., KALREZ 8900) and Daikin’s® DUPRA™. As will be described in further detail below, the annular-shaped object has spring properties that can enable the clamping mechanism 116 to hold a substrate placed within the substrate receiving area 112.

[0032] An annular-shaped object (e.g., O-ring or washer) can have dimensions including, outside or outer diameter (OD), inside or inner diameter (ID), and cross-sectional diameter or thickness (CSD). The OD is a diameter measured between one outer border of the annular-shaped object and another outer border of the annular-shaped object. The ID is a diameter measured between one inner border of the annular-shaped object to another inner border of the annularshaped object. The CSD is measured as a diameter of the circle exposed by cutting the annularshaped object. The CSD can be calculated from the OD and ID as — y— - • In an illustrative embodiment, the annular-shaped object can have an ID between about 3 mm to about 8 mm, an OD between about 5 mm to about 10 mm, and a CSD between about 0.8 mm to about 1.2 mm. More specifically, the annular-shaped object can have an ID of about 4.5 mm, an OD of about 6.5 mm, and a CSD of about 1 mm.

[0033] Although not shown in this illustrative embodiment, the clamping mechanism 116 can include a polygonal-shaped object in alternative embodiments. More specifically, the polygonal-shaped object can include a quadrilateral shaped object (e.g., a trapezoidal shaped object). For example, the polygonal-shaped object can be a rounded quadrilateral shaped object (e.g., rounded trapezoidal shaped object) having notch or cutout, that can flex towards the notch or cutout when pressure is exerted on the polygonal -shaped object. In some embodiments, the polygonal-shaped object includes a nonstick material. The nonstick material can be, e.g., polytetrafluoroethylene (PTFE) or other suitable nonstick material. Further details regarding these alternative embodiments will be described below with reference to FIGs. 4A and 4B.

[0034] The carrier base 110 may have a hardness that is greater than a hardness of the substrate. Accordingly, the clamping force exerted on the substrate by the clamping mechanism 116 can under certain circumstances damage the substrate. In one embodiment, a protective feature (not shown) is disposed on a second sidewall of the substrate receiving area 112 that is opposite the first sidewall at which the clamping mechanism 116 is located. The protective feature may be a coating on the second sidewall or a strip of material disposed on the sidewall, for example. The protective feature may have a first hardness that is lower than a second hardness of the substrate. In one embodiment, the protective feature is formed from a same material as the clamping mechanism 116. Since the protective feature has a lower hardness than the substrate, it may prevent the substrate from being damaged during clamping of the substrate. [0035] As shown, the carrier base 110 can include multiple substrate receiving areas, and each substrate receiving area can include a clamping mechanism at a side or edge of the respective substrate receiving area. In the illustrated example, the carrier base includes nine equally sized and shaped substrate receiving areas. However, the carrier base 110 may include other numbers of substrate receiving areas, which may have the same size and shape or may have different sizes and/or shapes.

[0036] Although the substrate carrier 100 is shown to include a single clamping mechanism per substrate receiving area, a substrate carrier can alternatively include multiple clamping mechanisms per substrate receiving area. In some embodiments, two clamping mechanisms are formed on two respective sides of the substrate receiving area. For example, a pair of clamping mechanisms can be formed on opposite sides of the substrate receiving area. As another example, a pair of clamping mechanisms can be formed on orthogonal sides of the substrate receiving area. In some embodiments, at least three clamping mechanisms are formed on at least three respective sides of the substrate receiving area.

[0037] FIG. 2 is a top-down view of the formation of a carrier assembly 200, in accordance with some embodiments. As shown, the carrier assembly 200 includes the substrate carrier 100, which includes the carrier base 110, the substrate receiving area 112, the side of the substrate receiving area 114, and the clamping mechanism 116 including an annular-shaped object wrapped around the circular structure 118. For example, the annular-shaped object of the clamping object can be an O-ring or a washer. As further shown, a substrate 202 is inserted into the substrate receiving area 112 to form the carrier assembly. In some embodiments, the substrate 202 can include glass. More specifically, the substrate 202 can be a glass coupon. For example, the substrate receiving area 112 can be sized to account for substrate tolerances (e.g., glass coupon tolerances).

[0038] The annular-shaped object of the clamping mechanism 116 has spring-like properties that can enable the clamping mechanism 116 to hold the substrate 202 within the substrate receiving area 112. More specifically, an approximately horizontal force resulting from the compression of the annular-shaped object of the clamping mechanism 116 by the substrate 202 (e.g., a compressive force) can securely hold the substrate 202 within the substrate receiving area 112. Additionally, an approximately vertical force generated by friction between the substrate 202 and the annular-shaped object of the clamping mechanism 116 (e.g., frictional force) can keep the substrate 202 from sliding vertically out of the carrier assembly 200. The amount of compression force and/or frictional force generated by the substrate 202 is based at least in part on the material properties of the clamping mechanism 116 and the material properties of the substrate 202. Thus, the clamping mechanism 116 can be chosen to have properties to enable sufficient compression and/or frictional forces to hold a particular substrate 202 within the carrier assembly 200.

[0039] FIG. 3A is a perspective view of an apparatus 300 in accordance with some embodiments. The apparatus 300 includes a susceptor 310 and a carrier assembly 320 disposed on the susceptor 310. The susceptor 310 can hold the carrier assembly 320 during processing. For example, the susceptor 310 can be made of a material which can absorb energy to heat the carrier assembly. Accordingly, the material of the susceptor 310 can be chosen based on the particular processing environment. A mask 330 or cover can be placed over the substrate carrier 320 and the substrates disposed within substrate-receiving areas of the substrate carrier. The mask 330 may be a patterned mask and may include one or more openings to expose the substrates or portions of the substrates. The top of the substrates may be flush or approximately flush with a top surface of the substrate carrier 320 in embodiments, and thus there may be no gap or a minimal gap between a bottom of the mask 330 and the top surface of the carrier 320 and/or the top surfaces of the substrates. An etch or deposition process may be performed while the mask 330 is disposed on the substrate carrier 330, causing a film to be deposited on the exposed substrates or portions of the substrates or causing a film on the exposed substrates or the exposed portions of the substrates to be etched.

[0040] FIG. 3B is a cross-sectional view of the apparatus 300 including the mask 320 disposed on the carrier assembly 320. A box 340 is shown to indicate a region of the apparatus 300. FIG. 3C is a cross-sectional view of the apparatus 300 corresponding to the region indicated by the box 340. As shown, the carrier assembly 320 includes a carrier base 322, clamping mechanisms 324-1 and 324-2 (e.g., O-rings or washers), and a substrate 326 disposed against the clamping mechanism 324-1. As described in further detail above with reference to FIG. 2, an approximately horizontal force generated by substrate 326 compressing the clamping mechanism 324-1 (e.g., a compressive force) and/or an approximately vertical force generated by friction between the substrate 326 and the clamping mechanism 324-1 (e.g., frictional force) can securely hold the substrate 326 in place within the carrier assembly 320.

[0041] As shown, the clamping mechanism 324-1 may be ring shaped such that the point of the clamping mechanism 324-1 having the greatest diameter is halfway between a top and bottom of the ring clamping mechanism 324-1. This causes the horizontal force from the clamping mechanism 324-1 to be exerted approximately at a halfway point between a top and bottom of the secured substrate 326. Alternatively, the clamping mechanism 324-1 may be shaped such that the point of the clamping mechanism 324-1 having the greatest diameter is at or near a top the ring clamping mechanism 324-1. This causes the horizontal force from the clamping mechanism 324-1 to be exerted approximately at or near a top of the secured substrate 326. Alternatively, the clamping mechanism 324-1 may be shaped such that the point of the clamping mechanism 324-1 having the greatest diameter is at or near a bottom of the ring clamping mechanism 324-1. This causes the horizontal force from the clamping mechanism 324-1 to be exerted approximately at or near a bottom of the secured substrate 326.

[0042] The embodiments described above with reference to FIGs. 1-3 have focused on embodiments in which the clamping mechanism can include an annular-shaped object (e.g., Ciring or washer). As will now be described in further detail below with reference to FIGs. 4A-4D, the clamping mechanism can include a polygonal-shaped object (e.g., quadrilateral shaped object).

[0043] FIG. 4A is a top-down view of a carrier assembly 400 before insertion of a substrate into a substrate receiving area. FIGs. 4B and 4C are top-down views of the carrier assembly 400 after insertion of the substrate into a substrate receiving area, and FIG. 4D is a cross-sectional view of the carrier assembly 400 through line A- A’, according to embodiments. As shown, the carrier assembly 400 includes a carrier base 410, a substrate receiving area 412, a side of the substrate receiving area 414, a clamping mechanism 416 disposed adjacent to the side 414, a substrate 418 secured by the clamping mechanism 416 within the substrate receiving area 412, and a region 420. In this illustrative embodiment, the region 416 is an empty region. However, in some embodiments, the region 420 can include a second clamping mechanism (not shown). [0044] The carrier base 410 and the substrate 418 can include the same or similar materials as the other carrier bases and the substrates described above. However, as shown, the clamping mechanism 416 includes a polygonal-shaped object that includes a protrusion 419 and a notch or cutout 417 proximate to the protrusion 419. The protrusion 419 extends into the substrate receiving area 414 (and past the side of the substrate receiving area 414). When the substrate 418 is inserted into the substrate receiving area 414, the substrate exerts a force on the protrusion 419. The notch or cutout 417 enables the polygonal-shaped object to flex away from the substrate 418. The polygonal -shaped object then maintains a flexed position while the substrate 418 is disposed in the substrate receiving area 414, and exerts an approximately horizontal force on the substrate to secure the substrate to the substrate carrier. In this illustrative embodiment, the polygonalshaped object is a quadrilateral-shaped object (e.g., trapezoidal-shaped object). More specifically, the polygonal -shaped object is a rounded quadrilateral shaped object (e.g., a rounded trapezoidal shaped object). In some embodiments, the polygonal -shaped object is comprised of a nonstick material. For example, the nonstick material can be polytetrafluoroethylene (PTFE).

[0045] The carrier base 410 may have a hardness that is greater than a hardness of the substrate 418. Accordingly, the clamping force exerted on the substrate 418 by the clamping mechanism 416 can under certain circumstances damage the substrate 418. In one embodiment, a protective feature (not shown) is disposed on a second sidewall of the substrate receiving area 414 that is opposite the first sidewall at which the clamping mechanism 416 is located. The protective feature may be a coating on the second sidewall or a strip of material disposed on the sidewall, for example. The protective feature may have a first hardness that is lower than a second hardness of the substrate 418. In one embodiment, the protective feature is formed from a same material as the clamping mechanism 416. Since the protective feature has a lower hardness than the substrate 418, it may prevent the substrate 418 from being damaged during clamping of the substrate 418.

[0046] Like the annular-shaped objects described above with reference to FIGs. 1-3, the polygonal-shaped object similarly exerts an approximately horizontal force on the substrate. However, the polygonal-shaped object of the clamping mechanism 416 can provide less horizontal force than the annular-shaped objects. For example, due to the compressive (e.g., elastic) material composition of the annular-shaped objects, the annular-shaped objects can exert a larger compressive force against the substrate.

[0047] FIG. 5 depicts a flow diagram of a method 500 of forming a substrate carrier, in accordance with some embodiments. For example, the substrate carrier can be similar to the substrate carrier described above with reference to FIGs. 1-4.

[0048] At block 502, at least one substrate receiving area having a substrate-shaped depression including a plurality of sidewalls is formed within a carrier base. Forming the at least one substrate receiving area can include machining the surface of the carrier base. However, any suitable process can be used to form the at least one substrate receiving area in accordance with the embodiments described herein. For example, the substrate-shaped depression can have a rectangular shape, such that the plurality of sidewalls includes four sidewalls. In some embodiments, the at least one substrate receiving area includes a plurality of substrate receiving areas.

[0049] At block 504, a clamping mechanism is formed disposed adjacent to a first sidewall of the plurality of sidewalls of the at least one substrate receiving area. In some embodiments, the clamping mechanism extends into the substrate receiving area and past the first sidewall. Accordingly, the substrate carrier can be formed to include a carrier base, at least one substrate receiving area, and at least one clamping mechanism.

[0050] The clamping mechanism includes a material compressible by a substrate inserted into the substrate receiving area to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier. In some embodiments, the carrier base can have an approximately flat upper surface, such that a top of the clamping mechanism can be below or flush with the approximately flat upper surface of the carrier base. Accordingly, the clamping mechanism can include a compressive body that compresses away from the second side responsive to insertion of the substrate into the substrate receiving area.

[0051] In some embodiments, forming the clamping mechanism includes building a circular structure with the carrier base (e.g., by machining the surface of the carrier base), and wrapping an annular-shaped object including a compressive material around the circular structure. The annular-shaped object is to compress against the circular structure responsive to insertion of the substrate into the substrate receiving area. In some embodiments, forming the clamping mechanism can further forming a ring-shaped depression within the carrier base that circumscribes the circular structure, and disposing the annular-shaped object within the ringshaped depression. For example, the annular-shaped object can include an O-ring. As another example, the annular-shaped object can include a washer. Further details regarding the clamping mechanism be formed to include an annular-shaped object are described above with reference to FIGs. 1-2

[0052] In some embodiments, forming the clamping mechanism includes forming a polygonal-shaped object region within the carrier base, and forming a polygonal-shaped object within the polygonal-shaped object region. For example, the polygonal -shaped object can be a quadrilateral-shaped object (e.g., a trapezoidal-shaped object). More specifically, the quadrilateral-shaped object can be a rounded quadrilateral-shaped object (e.g., a rounded trapezoidal-shaped object). In some embodiments, the polygonal-shaped object can be formed from a nonstick material. The nonstick material can be, e.g., polytetrafluoroethylene (PTFE) or other suitable nonstick material. Further details regarding the clamping mechanism including a polygonal-shaped object are described above with reference to FIGs. 4A-4B.

[0053] FIG. 6 depicts a flow diagram of a method 600 of forming a carrier assembly, in accordance with some embodiments. For example, the carrier assembly can be similar to the carrier assembly described above with reference to FIGs. 2-4.

[0054] At block 602, a substrate carrier having a clamping mechanism disposed adjacent to a corresponding side of a substrate receiving area is provided. For example, the substrate carrier provided at block 602 can be the substrate carrier formed in accordance with the method 500 of FIG. 5. At block 604, a substrate is inserted into the substrate receiving area using the clamping mechanism to form a carrier assembly. [0055] As described above, the clamping mechanism includes a material compressible by the substrate to exert an approximately horizontal force against the substrate. The approximately horizontal force is to press the substrate against a second side of the substrate receiving area that is opposite the first side of the substrate receiving area to secure the substrate to the substrate carrier. In some embodiments, the carrier base can have an approximately flat upper surface, such that a top of the clamping mechanism can be below or flush with the approximately flat upper surface of the carrier base. Accordingly, the clamping mechanism can include a compressive body that compresses away from the second side responsive to insertion of the substrate into the substrate receiving area.

[0056] Further details regarding the clamping mechanism be formed to include an annularshaped object are described above with reference to FIGs. 1-2 and 5.

[0057] In some embodiments, the clamping mechanism includes a polygonal -shaped object. For example, the polygonal-shaped object can be a quadrilateral-shaped object (e.g., a trapezoidal-shaped object). More specifically, the quadrilateral-shaped object can be a rounded quadrilateral-shaped object (e.g., a rounded trapezoidal-shaped object). In some embodiments, the polygonal -shaped object can be formed from a nonstick material. The nonstick material can be, e.g., polytetrafluoroethylene (PTFE) or other suitable nonstick material. Further details regarding the clamping mechanism including a polygonal-shaped object are described above with reference to FIGs. 4-5.

[0058] FIG. 7 depicts a flow diagram of a method 700 of utilizing a carrier assembly, in accordance with some embodiments. The carrier assembly can be similar to the carrier assembly described about with reference to FIGs. 2-4 and formed in accordance with the method 600 of FIG. 6

[0059] At block 702, a carrier assembly is placed on a susceptor. The carrier assembly can include a carrier base, a substrate receiving area, a clamping mechanism disposed adjacent to a first side of a plurality of sidewalls of the substrate receiving area, and a substrate inserted into the substrate receiving area using the clamping mechanism.

[0060] At block 704, a mask is applied to the carrier assembly. Further details regarding block 704 are described above with reference to FIGs. 3A-3C.

[0061] The preceding description sets forth numerous specific details such as examples of specific systems, components, methods, and so forth, in order to provide a good understanding of several embodiments of the present invention. It will be apparent to one skilled in the art, however, that at least some embodiments of the present invention may be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram format in order to avoid unnecessarily obscuring the present invention. Thus, the specific details set forth are merely exemplary. Particular implementations may vary from these exemplary details and still be contemplated to be within the scope of the present invention.

[0062] Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. In addition, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” When the term “about” or “approximately” is used herein, this is intended to mean that the nominal value presented is precise within ±10%. [0063] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be altered so that certain operations may be performed in an inverse order or so that certain operation may be performed, at least in part, concurrently with other operations. In another embodiment, instructions or suboperations of distinct operations may be in an intermittent and/or alternating manner.

[0064] It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other implementation examples will be apparent to those of skill in the art upon reading and understanding the above description. Although the present disclosure describes specific examples, it will be recognized that the systems and methods of the present disclosure are not limited to the examples described herein, but may be practiced with modifications within the scope of the appended claims. Accordingly, the specification and drawings are to be regarded in an illustrative sense rather than a restrictive sense. The scope of the present disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.