Title:
CLEANING AGENT FOR METAL WIRING SUBSTRATE, AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/168166
Kind Code:
A1
Abstract:
The present invention relates to a cleaning agent for a substrate having metal wiring, the agent characterized by being used in a cleaning step following chemical mechanical polishing (CMP) in a semiconductor element production process, and characterized by comprising an aqueous solution which has a pH of 10 or higher and contains (A) a carboxylic acid which has a nitrogen-containing heterocyclic ring and (B) an alkylhydroxylamine. The present invention also relates to a method for cleaning a semiconductor substrate, the method characterized by using the cleaning agent.
Inventors:
MIZUTA HIRONORI (JP)
WATAHIKI TSUTOMU (JP)
MAESAWA TSUNEAKI (JP)
WATAHIKI TSUTOMU (JP)
MAESAWA TSUNEAKI (JP)
Application Number:
PCT/JP2014/060257
Publication Date:
October 16, 2014
Filing Date:
April 09, 2014
Export Citation:
Assignee:
WAKO PURE CHEM IND LTD (JP)
International Classes:
H01L21/304; C11D7/32
Domestic Patent References:
| WO2012073909A1 | 2012-06-07 | |||
| WO2005040324A1 | 2005-05-06 | |||
| WO2012073909A1 | 2012-06-07 |
Foreign References:
| JP2008519295A | 2008-06-05 | |||
| JP2007525836A | 2007-09-06 | |||
| JP2010235725A | 2010-10-21 | |||
| JP2002359223A | 2002-12-13 | |||
| JP2012186470A | 2012-09-27 | |||
| JP2001517863A | 2001-10-09 | |||
| JP2005217114A | 2005-08-11 | |||
| JP2006063201A | 2006-03-09 |
Other References:
See also references of EP 2985783A4
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