Title:
CLEANING COMPOSITION FOR ADHESIVES
Document Type and Number:
WIPO Patent Application WO/2023/243661
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a cleaning composition that is for adhesives, and that exhibits excellent removability of the adhesives. One embodiment of the present disclosure pertains to a cleaning composition for removing adhesives remaining on wafers. This cleaning composition for adhesives contains a glycol ether (component A), a hydrocarbon (component B), and an alkanolamine (component C) having a linear alkanol group, and does not contain water or contains water in an amount of 10 mass% or less. The mass ratio A/B between the contained amount of component A and the contained amount of component B is 1.7 or less.
Inventors:
TOTOKI TAKENORI
YAMADA KOUHEI
YAMADA KOUHEI
Application Number:
PCT/JP2023/022091
Publication Date:
December 21, 2023
Filing Date:
June 14, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
H01L21/304; C11D7/26; C11D7/32; C11D7/50
Domestic Patent References:
| WO2016194917A1 | 2016-12-08 |
Foreign References:
| JPH11286698A | 1999-10-19 | |||
| JP2009114268A | 2009-05-28 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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