Title:
CLEANING PROCESS AND SEMICONDUCTOR PROCESS METHOD
Document Type and Number:
WIPO Patent Application WO/2022/166087
Kind Code:
A1
Abstract:
A cleaning process. The cleaning process is used for cleaning a surface of a semiconductor structure, the surface of the semiconductor structure has a residue layer formed thereon, and the cleaning process comprises: providing first reactant gas and second reactant gas to the surface of the semiconductor structure, wherein the first reactant gas reacts with the second reactant gas so as to form a protective layer (3) on the surface of the semiconductor structure while removing the residue layer.
Inventors:
CUI ZHAOPEI (CN)
ZHU BINGYU (CN)
ZHU BINGYU (CN)
Application Number:
PCT/CN2021/103645
Publication Date:
August 11, 2022
Filing Date:
June 30, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/02
Foreign References:
| CN112951711A | 2021-06-11 | |||
| CN104733283A | 2015-06-24 | |||
| CN111357081A | 2020-06-30 | |||
| CN108269762A | 2018-07-10 | |||
| CN110911266A | 2020-03-24 | |||
| US20160059272A1 | 2016-03-03 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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