Title:
CLEANING SHEET AND CLEANING SHEET MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/112116
Kind Code:
A1
Abstract:
In a cleaning sheet (100) in which a cleaning layer (20) is bound to a surface of a base material sheet (10), there has been a problem that, in temperature conditions at which the cleaning sheet is used, warping occurs due to thermal deformation caused by the difference in thermal expansion coefficient between the base material sheet (10) and the cleaning layer (20). In order to solve this problem, the present invention is characterized by providing thermal deformation absorption grooves (11) on at least one of the base material sheet (10) side and the cleaning layer (20) side of a joining surface (100A) between the base material sheet (10) and the cleaning layer (20).
Inventors:
NAKASHIMA TOMONAO (JP)
KINOSHITA TOMOHIRO (JP)
KINOSHITA TOMOHIRO (JP)
Application Number:
PCT/JP2021/045948
Publication Date:
June 22, 2023
Filing Date:
December 14, 2021
Export Citation:
Assignee:
JAPAN ELECTRONIC MAT CORPORATION (JP)
International Classes:
H01L21/66; G01R1/073
Foreign References:
| JP2005197545A | 2005-07-21 | |||
| JP2004317272A | 2004-11-11 | |||
| JP2011117938A | 2011-06-16 | |||
| JP2016078202A | 2016-05-16 | |||
| JP2006165395A | 2006-06-22 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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