Title:
CLOUD SERVICE DEPLOYMENT METHOD BASED ON CLOUD COMPUTING AND CLOUD MANAGEMENT PLATFORM
Document Type and Number:
WIPO Patent Application WO/2024/103726
Kind Code:
A1
Abstract:
The present application provides a cloud service deployment method based on cloud computing and a cloud management platform. The method is applied to the cloud management platform, and comprises: the cloud management platform provides a network instance configuration interface, wherein the network instance configuration interface is used for receiving first configuration information input by a first tenant, and the first configuration information is used for indicating the specification of a first network instance to be created; and the cloud management platform selects a first server from a first server resource pool according to the first configuration information, and deploys a first network instance on the first server, wherein the first network instance processes a service packet associated with the first tenant on the basis of a hardware resource provided by a first network forwarding chip, the first server is provided with the first network forwarding chip, and the first network forwarding chip provides a hardware resource matching the specification indicated by the first configuration information to the first network instance. According to the present application, by configuring a server resource pool dedicated to deploying a plurality of network instances, the processing efficiency of the service packet associated with the tenant is improved.
Inventors:
LIU BING (CN)
HE LUYOU (CN)
GAO FENG (CN)
WANG LIGUO (CN)
HE LUYOU (CN)
GAO FENG (CN)
WANG LIGUO (CN)
Application Number:
PCT/CN2023/101850
Publication Date:
May 23, 2024
Filing Date:
June 21, 2023
Export Citation:
Assignee:
HUAWEI CLOUD COMPUTING TECH CO LTD (CN)
International Classes:
H04L41/0803
Foreign References:
CN115118585A | 2022-09-27 | |||
CN114389905A | 2022-04-22 | |||
CN114338606A | 2022-04-12 | |||
US11159344B1 | 2021-10-26 | |||
US20210132981A1 | 2021-05-06 |
Download PDF:
Previous Patent: EARBUD
Next Patent: SILICON CARBIDE EPITAXIAL WAFER, AND PREPARATION METHOD THEREFOR AND USE THEREOF
Next Patent: SILICON CARBIDE EPITAXIAL WAFER, AND PREPARATION METHOD THEREFOR AND USE THEREOF