Title:
CO-CURABLE COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO2004037878
Kind Code:
A3
Abstract:
A co-curable composition wherein the benefits of both epoxy resins and maleimides are enjoyed is obtained from a blend of an epoxy or episulfide resin, a free radical polymerizable component, and a crosslinker reactive with both the epoxy or episulfide resin and the free radical polymerizable component. The free radical polymerizable component includes a maleimide, itaconimide or nadimide compound. A crosslinker is defined having the structure A/C--X--FR wherein A/C is an anionically or cationically reactive functional group, X is a spacer and FR is free radically reactive functional group. A maleated (styrene)-butadiene copolymer as a crosslinker is also denoted. A method of co-curing the composition, a method for adhesively attaching a chip die to another chip die or a circuit board, and a semiconductor chip attached to and in electrical interconnection with either another semiconductor chip or a carrier substrate are espoused.
Inventors:
LIU PUWEI (US)
NEFF BENJAMIN (US)
ZHANG ZHENGJUE (US)
YANG KANG (US)
NEFF BENJAMIN (US)
ZHANG ZHENGJUE (US)
YANG KANG (US)
Application Number:
PCT/US2003/033243
Publication Date:
June 24, 2004
Filing Date:
October 20, 2003
Export Citation:
Assignee:
HENKEL CORP (US)
LIU PUWEI (US)
NEFF BENJAMIN (US)
ZHANG ZHENGJUE (US)
YANG KANG (US)
LIU PUWEI (US)
NEFF BENJAMIN (US)
ZHANG ZHENGJUE (US)
YANG KANG (US)
International Classes:
B32B27/38; C08L63/00; H01L21/50; H01L21/58; (IPC1-7): C09J139/04; C09J151/04; C09J163/00; C09J163/02; H01L23/14
Domestic Patent References:
| WO2003107427A1 | 2003-12-24 | |||
| WO1998030647A1 | 1998-07-16 |
Foreign References:
| JP2000104032A | 2000-04-11 | |||
| US6048576A | 2000-04-11 | |||
| US6359039B1 | 2002-03-19 | |||
| US6034195A | 2000-03-07 | |||
| US20030230814A1 | 2003-12-18 |
Other References:
DATABASE CAPLUS [online] PILIPENKO ET AL.: "Maleimides as Effective Modifiers for Epoxy Resins", XP002976739, Database accession no. 1988:632060
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