Title:
COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/098836
Kind Code:
A1
Abstract:
The present invention provides a manufacturing method by which a coated solder wire having a dense coating film of polysiloxane uniformly provided over the entire surface of the solder wire can be obtained efficiently, through a single process. This method for manufacturing a coated solder wire comprises a radicalization step for mixing a reactant gas transformed into a plasma at atmospheric pressure, and an organosilicon compound introduced through the agency of carrier gas, and radicalizing the organosilicon compound to form a radicalized organosilicon compound; a reaction area formation step for forming a reaction area which is demarcated by a spiral gas flow and in which the radicalized organosilicon compound is uniformly dispersed; and a coating step for transporting the solder wire into the reaction area, and reacting the metal at the solder wire surface with the radicalized organosilicon compound, thereby forming a coating film of polysiloxane having a thickness of 4-200 nm on the solder wire surface.
Inventors:
KOBAYASHI HIROSHI (JP)
YAMABE HIDETOSHI (JP)
YAMABE HIDETOSHI (JP)
Application Number:
PCT/JP2015/085280
Publication Date:
June 23, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B23K35/14; B23K35/40; C23C26/00
Foreign References:
| JP2014195831A | 2014-10-16 | |||
| JP2006088205A | 2006-04-06 | |||
| JPH0919794A | 1997-01-21 |
Other References:
See also references of EP 3235586A4
Attorney, Agent or Firm:
Kiwa International (JP)
Patent business corporation Takakazu patent firm (JP)
Patent business corporation Takakazu patent firm (JP)
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