Title:
COATING FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/137871
Kind Code:
A1
Abstract:
A coating film formation method according to the present invention includes: a first step in which a polysilazane-containing first solution is applied to a surface 2a of a metal substrate 2, and the first solution is heated to cause silica conversion and form a first coating film 1 having open defects 3 on the surface 2a of the metal substrate 2; and a second step in which a polysilazane-containing second solution is applied to a surface 1a of the first coating film 1 to fill the open defects 3, and the second solution is heated at a lower temperature than the heating temperature at the first step to cause silica conversion and form a second coating film 5 on the surface 1a of the first coating film 1.
Inventors:
TANABE TAKAOMI (JP)
KAWACHI SEIICHIRO (JP)
HIYAMA KOSAKU (JP)
KAWACHI SEIICHIRO (JP)
HIYAMA KOSAKU (JP)
Application Number:
PCT/JP2021/041588
Publication Date:
June 30, 2022
Filing Date:
November 11, 2021
Export Citation:
Assignee:
TOCALO CO LTD (JP)
International Classes:
C23F11/00; B05D1/38; B05D7/14; B05D7/24; C23C26/00
Foreign References:
| JP2002105676A | 2002-04-10 | |||
| JP2001181861A | 2001-07-03 | |||
| JP2006347827A | 2006-12-28 |
Attorney, Agent or Firm:
SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)
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