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Title:
COIL ANTENNA, WIRELESS IC DEVICE, RESIN MOLDED BODY, AND COIL ANTENNA MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/031408
Kind Code:
A1
Abstract:
A wireless IC device (101) having a coil antenna is provided with a first substrate (1), a first metal post (30), a second metal post (40), and a connecting conductor (50). Linear conductor patterns (first linear conductor patterns (10A, 10B)) are formed on a first main surface (PS1) of the first substrate (1). The first metal post (30) and the second metal post (40) are disposed such that the first metal post and the second metal post extend in the normal line direction with respect to the first main surface (PS1) of the first substrate (1), and first ends (30E1, 40E1) of respective posts are connected to the first linear conductor patterns (10A, 10B), respectively. A first end (50E1) of the connecting conductor (50) is connected to a second end (30E2) of the first metal post (30), and a second end (50E2) of the connecting conductor (50) is connected to a second end (40E2) of the second metal post (40). A second end (10AE2) of the first linear conductor pattern (10A), and a second end (10BE2) of the first linear conductor pattern (10B) are power feeding ends.

Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2015/070018
Publication Date:
March 03, 2016
Filing Date:
July 13, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q7/00; G06K19/077; H01Q7/06
Domestic Patent References:
WO2011093091A12011-08-04
WO2014123052A12014-08-14
WO2014083916A12014-06-05
Foreign References:
JP2012105062A2012-05-31
JP2014093675A2014-05-19
JP2014107606A2014-06-09
JP2002288609A2002-10-04
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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