Title:
COIL FORMING JIG
Document Type and Number:
WIPO Patent Application WO/2015/147253
Kind Code:
A1
Abstract:
This coil forming jig sequentially subjects a rectangular wire (801) to flatwise bends (F1, F2) and edgewise bends (E1, E2) by sliding a second jig (3) in a proximal direction (S1). The second jig (3) slides in a distal direction (S2) opposite of the proximal direction (S1) to move away from the first jig on which a crossing part (82) is formed. A bulge portion (83) is formed bulging in the inner portion of the bending on a second wide lateral surface (803B), and in the position opposite of the bulge portion (83), the second jig (3) has an escape groove (36) for allowing escape of the bulge portion (83) when the edgewise bend (E2) is performed. The escape groove (36) is provided along the path through which the bulge portion (83) passes when the second jig (3) slides in the distal direction (S2). Thus, the second jig (3) slides relative to the first jig by means of a simple structure, and the shape of the coil after formation is prevented from collapsing.
Inventors:
HASHIMOTO SHINGO (JP)
OTA TAKANORI (JP)
ITO KATSUYA (JP)
OTA TAKANORI (JP)
ITO KATSUYA (JP)
Application Number:
PCT/JP2015/059582
Publication Date:
October 01, 2015
Filing Date:
March 27, 2015
Export Citation:
Assignee:
AISIN AW CO (JP)
International Classes:
H02K15/04; B21D7/04; B21F1/00
Foreign References:
| JP2012239371A | 2012-12-06 | |||
| JP2011010528A | 2011-01-13 | |||
| US20100325874A1 | 2010-12-30 | |||
| JP2014205163A | 2014-10-30 | |||
| JP2015100251A | 2015-05-28 |
Attorney, Agent or Firm:
AICHI, Takahashi, Iwakura & Associates (JP)
Patent business corporation あいち international patent firm (JP)
Patent business corporation あいち international patent firm (JP)
Download PDF:
Previous Patent: SETSCREW, AFFIXATION STRUCTURE, AFFIXATION METHOD, AND SEALING STRUCTURE
Next Patent: HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE
Next Patent: HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE