Title:
COIL MODULE AND ACTUATOR EQUIPPED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2020/189478
Kind Code:
A1
Abstract:
This coil module includes a substrate, a conductor layer, one or more elements and a sealing resin. The substrate comprises a semiconductor material. The conductor layer is formed on the substrate and includes a wiring section and a spiral-shaped coil section. The one or more elements are mounted on the wiring section. The sealing resin covers the substrate surface, the conductor layer and the one or more elements. The one or more elements include, for example, magnetic detection elements.
Inventors:
SAITO AKIHITO (JP)
NISHIMURA ISAMU (JP)
SEKIMOTO YOSHIHIRO (JP)
NISHIMURA ISAMU (JP)
SEKIMOTO YOSHIHIRO (JP)
Application Number:
PCT/JP2020/010722
Publication Date:
September 24, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01F5/00; H01F5/06; H01F7/06; H02K33/16; H05K1/16
Foreign References:
| JPH0314022Y2 | 1991-03-28 | |||
| JPS499921Y1 | 1974-03-09 | |||
| JPH07274467A | 1995-10-20 | |||
| JP2001359251A | 2001-12-26 | |||
| JP2019219564A | 2019-12-26 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF:
Previous Patent: COIL MODULE, ACTUATOR PROVIDED WITH COIL MODULE, AND METHOD FOR MANUFACTURING COIL MODULE
Next Patent: CONDUCTIVE SHEET
Next Patent: CONDUCTIVE SHEET