Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2014/087888
Kind Code:
A1
Abstract:
Provided is a coil module that has been made small and thin by incorporating a magnetic saturation-resistant material and structure. This coil module is equipped with a magnetic shield layer (4), which contains a magnetic material, and a spiral coil (2). The magnetic shield layer (4) has multiple magnetic resin layers (4a, 4b) that contain magnetic particles, and at least a portion of the spiral coil (2) is embedded in a portion of the magnetic resin layers (4a, 4b). Consequently, the coil module can be made small and thin while achieving a heat-dissipation effect with the magnetic resin layers. In addition, because magnetic resin layers that are resistant to magnetic saturation are provided, the coil inductance shows little change even in an environment where a strong magnetic field is applied, so stable communication can be carried out.
Inventors:
KUMURA TATSUO (JP)
KUBO YUSUKE (JP)
KUBO YUSUKE (JP)
Application Number:
PCT/JP2013/081836
Publication Date:
June 12, 2014
Filing Date:
November 27, 2013
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01Q7/06; H01F27/36; H01F38/14; H01Q1/40
Foreign References:
| JP2007116347A | 2007-05-10 | |||
| JP2006174223A | 2006-06-29 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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