Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2018/012378
Kind Code:
A1
Abstract:
A coil module (100) is provided with: a substrate (110) that has a coil antenna (111); and a resin member (120) that covers at least one main surface of the substrate, wherein the resin member (120) is provided with a booster coil (121) that is not directly connected to the coil antenna (111) but linked therewith via a magnetic field. The diameter of the booster coil (121) may be larger than the coil diameter of the coil antenna (111), the substrate (110) is a rigid substrate, and the resin member (120) may be a member that is more flexible than the substrate (110).
Inventors:
YONEMORI KEITO (JP)
Application Number:
PCT/JP2017/024702
Publication Date:
January 18, 2018
Filing Date:
July 05, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F38/14; H01F17/00; H01F27/29; H01F37/00; H01L23/12; H01L25/00
Domestic Patent References:
| WO2012032974A1 | 2012-03-15 |
Foreign References:
| JP2002083894A | 2002-03-22 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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