Title:
COMBINED SENSOR AND METHOD FOR MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/093056
Kind Code:
A1
Abstract:
Provided are a combined sensor (100) and a method for manufacture thereof. The combined sensor (100) comprises a first wafer (10), a second wafer (20), and a plurality of sensors; the first wafer (10) and the second wafer (20) are bonded and connected, and enclosed to form a plurality of independent sensors; an electrical isolation structure (30) is arranged between two adjacent sensors so as to provide a miniaturized, integrated, and combined sensor (100) having less electromagnetic interference.
Inventors:
QIU WENRUI (CN)
Application Number:
PCT/CN2019/123539
Publication Date:
May 20, 2021
Filing Date:
December 06, 2019
Export Citation:
Assignee:
WEIFANG GOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
G01D21/02
Foreign References:
| CN104409428A | 2015-03-11 | |||
| CN1664510A | 2005-09-07 | |||
| CN207705196U | 2018-08-07 | |||
| CN103663362A | 2014-03-26 | |||
| CN208637424U | 2019-03-22 | |||
| CN102280459A | 2011-12-14 | |||
| CN102798403A | 2012-11-28 | |||
| CN102502479A | 2012-06-20 | |||
| US7057247B2 | 2006-06-06 |
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