Title:
COMMUNICATION DEVICE AND METHOD FOR MANUFACTURING COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/199365
Kind Code:
A1
Abstract:
A communication device is provided with a surface-treated first metallic component, an exposed area being formed on at least part of the first metallic component, a metal foil disposed on the first metallic component so as to cover at least the exposed area, and a conductive component disposed on the metal foil and electrically connecting the first metallic component to a second metallic component via the metal foil.
Inventors:
UTSUNOMIYA DAIKI (JP)
Application Number:
PCT/JP2020/014969
Publication Date:
October 07, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
H01Q1/50; H05K9/00
Domestic Patent References:
WO2012117657A1 | 2012-09-07 |
Foreign References:
JPH04119700A | 1992-04-21 | |||
JP2011082571A | 2011-04-21 | |||
JP2010080515A | 2010-04-08 | |||
JP2010287590A | 2010-12-24 | |||
JP2007194545A | 2007-08-02 | |||
JP2011139283A | 2011-07-14 |
Other References:
See also references of EP 4131649A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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